Hot-Bar - Amada Miyachi

Hot-Bar technology is used to join parts where there are high demands on the process. By having a high control of heat and power, you can solder or ACF-bond on a local part of a card without heating the whole card. A defined programmable heat curve is transmitted in a particular area to create an electromechanical joint between one or more materials. Depending on the material specifications, the design of parts and the requirements for functionality of the final product, a separate Hot-Bar process is used.

The Hot-Bar process can be divided into three functional joining methods, each offering its own specific advantages.

• Hot-Bar remelting soldering
• Heat sealing & ACF bonding
• Heat strike

Uniflow 4 -  Remelting grid aggregate

UniFLOW 4 is a power supply for pulse heated selective soldering, conductive bonding and Heat Pressure bonding

• "Closed loop" temperature- and time control
• Displays summary process data
• Real-time temperature graph
• Stores 15 heating profiles
• Statistics and graphical output for PC
• Process alarms and counters.
• External programming via PC

Desktopserien - Pulsed Heating thermod Technology

Pulsed Heating thermod technology for remelting soldering and heat sealed glueing.

Miyachi Unitek desktopbonders are a standard bench machine Hot-Bar remelting soldering system that uses pulsed heating thermod technology (Uniflow® power supply), pneumatic bonding head and quick connectors to the thermodes. All modules are mounted on a simple adjustable frame construction. The Desktop Series includes handling features such as left-right and front-to-back movements as well as rotating tables.

NewHorizon Hot Bar Desktop Series

Designed for fine-pitch ACF applications with pitch greater than 30µm, ACF Anistotropic Conductive Film uses a two- or three-step process to apply and bond materials such as flex film to glass or flex film to PCB.