Automatic & Semi automatic Die Bonders - Tresky
Tresky has developed the 2nd generation of semi-automatic / automated die bonders. These machines are ideal for small to large production volumes. The machine is built to fit the customer's applications.
- Linear motors for high accuracy
- Waferstation, tape feeders
- Pick & place, with both dispensing and stamping
- Picking from wafer, waffle and gel pack
- Flip-chipcamera
- Pattern Recognition System
- Automatic toolchange
- Singel- och multi chip applications
- Scrubbing and Eutectics soldering with protective gas


T-6000 L/G - Flexible High Precision Automated Die bonder
The new T-6000 is a universal die bonder developed specifically for small and medium production volumes as well as development. Standard component management is done from Wafer, Gel-Pack or Waffle-Pack. Location accuracy 10 µm. In addition to the automatic mounting and the Pattern Recognition camera, the T-6000 allows you to manually perform single mountings without the need for complex programming through simple press-release technology.
- T-6000 L-G.pdf 1.4 MB
T-8000 Fully - automated Die bonder
The T-8000 is a universal die bonder developed specifically for extreme precision, placement accuracy of 5 µm, for medium-sized production volumes and development. 12 "wafer handling and even larger work area 500x450mm, otherwise the same applications and options as the T-6000 system.
- T-8000 - G.pdf 1.4 MB