Manual Die Bonders - Semiconductor Equipment Corp.

The manual Die Bonders pick & place stations are very easy to use. Typical use of Die Bonders is for development and prototype operations.

  • One bond head
  • Dispensing, stamping
  • Wafer pick-up
  • Waffle and gel pack pick up
  • Eutectic oven

MODEL 835 PICK AND PLACE SYSTEM

Model 835 is a perfect Die Bonder pick & place system for Die and surface mounting components. It offers manual or pneumatically controlled Z movement with semi-automatic vacuum pickup tool movement for moving Die and other small units from tape or carrier trays to packaging.

MODEL 850 FLIP CHIP PLACEMENT SYSTEM

The Model 850 is a versatile, semi-automatic placement system for "flip chips", "chip scale" devices and "bare die". The system is designed for low volume production and development projects that require accuracy of +/- 12 microns. An optional heating step (model 855) is available. An additional option, the SEC's Model 430 Hot Gas Jet Module can be integrated to work on the Model 850 as a heat source for air flow.

MODEL 860 EAGLE OMNI BONDER

The Model 860 Eagle is a multi-use semi-automatic system that is ideal for R&D and low volume production. Applications include solder and gold-stoppered flipchips, eutectic bonding including laser diodes and "bars" and epoxy bonding. Some of the process capabilities that support these applications are "ultrasonic", "thermosonic", "scrub", "flux dipping" and "hot gas spot heating". The new system is designed for maximum versatility and easy operation.