Automated Electroplating Systems

Advanced, single-wafer, high-throughput ECD and Surface Preparation – with up to four chambers

Automated Electroplating Systems

Advanced, single-wafer, high-throughput ECD and Surface Preparation – with up to eight chambers

Electroplating Development Systems

Semi-automated single-wafer Process
Development – with up to three chambers

Advanced Spray Solvent Tools

For semiconductor batch processing

Advanced Spin Rinse Dryers

For semiconductor batch processing