Wire bonding is a method of
making interconnections between a microchip and other electronics as part of
semiconductor device and fabrication. Wire diameters start at 15 µm and can be
up to several hundred micrometres for high-powered applications e.g. Automotive
applications etc. In either type of wire bonding, the wire is attached at both
ends using some combination of heat, pressure, and ultrasonic energy to make a
weld.
Wire bonding is generally considered the most cost-effective and flexible
interconnect technology, and is used to assemble the vast majority of
semiconductor packages.
F&K Delvotec is the only manufacturer supplying machines covering the complete
spectrum of wire bonding technologies: gold ball bonding, gold ball bumping,
wedge bonding for fine gold, aluminium wire and ribbon, wedge bonding for power
devices with heavy aluminium wire. There are a number of variations within
these categories, e.g. bond heads for high frequency components or ribbon
bonding. The base for all machines is identical, only the bond head changes. |
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