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Universal Semi-Automatic Wire Bonders
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The new 56XX series are the most flexible
machines on the market. They are easy to use and program the
high automation level in the machine makes them the perfect
choice for prototyping, small production series and repairs. |
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Changing heads in 1 minute |
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Motorized in all axels x, y, z and p |
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Programmable for automated mode |
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Ball-Wedge bond head |
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Wedge-Wedge bond head |
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Deep Access Wedge- Wedge bond head |
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Heavy wire bond head (under developing) |
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Pull test heads |
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Shear test heads |
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Peel test head |
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Heavy wire Ribbon Bonder 5650HR
The cost effective and flexible alternative to an automatic bonder!
Aluminium Ribbon Dimensions:
W = 40 80 mil (1000 - 2000 µm), T = 4 12 mil (100 300 µm)
Video Presentation |
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Wire-Wedge Bonder 5650
Within minutes the bonder is converted into a pull/shear tester without any
tools or adjustments. Thus bonded parts can be tested immediately.
Video Presentation |
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Wire Bonder 5610
The 5610 is fully PC controlled and allows any number of bonds and bumps to be
programmed. Pre-programmed adjust points are targeted through the cameras
crosshair targeting system and the programmed bonds or bumps are executed
automatically.
Video Presentation |
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Wire Bonder 5630
Wedge/Wedge bonder and pull/shear tester combined in one machine. Closing the
gap between manual and automatic bonders from F&K Delvotec. 360° rotary
bondhead, Al/Au wires from 17,5 up to 75µm, 60 or 100KHz ultrasonic system,
work area 100x100mm, Z-stroke of rotary bondhead 60mm, integrated PC, 15" TFT
flat screen, heater controller and various workholders. Microscope camera with
crosshair for target view and programming.
Video Presentation |
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Wire Bonder 5632
The semi-automatic Wedge-Wedge Bonder 5632 fills the gap between the
manual Wedge- Bonders series 53xx and 54xx from F & KDelvotec
Semiconductor to the automatic-Bonder from F & K Delvotec.
Video Presentation |
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