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Universal Semi-Automatic Wire Bonders

Heavy wire Ribbon Bonder 5650HR
The cost effective and flexible alternative to an automatic bonder!
Aluminium Ribbon Dimensions:
W = 40 – 80 mil (1000 - 2000 µm), T = 4 – 12 mil (100 – 300 µm)

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Wire-Wedge Bonder 5650
Within minutes the bonder is converted into a pull/shear tester without any tools or adjustments. Thus bonded parts can be tested immediately.

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Wire Bonder 5610
The 5610 is fully PC controlled and allows any number of bonds and bumps to be programmed. Pre-programmed adjust points are targeted through the cameras crosshair targeting system and the programmed bonds or bumps are executed automatically.

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Wire Bonder 5630
Wedge/Wedge bonder and pull/shear tester combined in one machine. Closing the gap between manual and automatic bonders from F&K Delvotec. 360° rotary bondhead, Al/Au wires from 17,5 up to 75µm, 60 or 100KHz ultrasonic system, work area 100x100mm, Z-stroke of rotary bondhead 60mm, integrated PC, 15" TFT flat screen, heater controller and various workholders. Microscope camera with crosshair for target view and programming.

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Wire Bonder 5632
The semi-automatic Wedge-Wedge Bonder 5632 fills the gap between the manual Wedge- Bonders series 53xx and 54xx from F & KDelvotec Semiconductor to the automatic-Bonder from F & K Delvotec.

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