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Adding value to Nordic Microelectronics manufacturing industry

Die Bonding
Wire Bonding
Testing & Repair
 Welding
Device Bonding
Wafer
Hybrid
Cleaning
Tools & Materials

CONTACT
MPE Nordic AB
Gränsbovägen 4
SE-152 42 Södertälje
Sweden

Tel +46 (0)8 550 656 59
Fax +46 (0)8 550 156 59
infompenordic.com

SUPPLIERS

F & K Delvotec

GSI Group Inc

DeWeyl Tool

HILPERT

  S.E.T.

SEC

  Norcom
  Tanaka
  Miyachi Unitek
Benchmark Division
  March
  MIDAS
Technology

 

Semi-Automatic Wire Bonders

Manual and semiautomatic bonder ideal for small production and laboratories.

Motorized in y and z

Programmable wires

Ball-Wedge bond head

Wedge-Wedge bond head

Deep Access Wedge- Wedge bond head

Heavy wire bond head

Wire Bonder 5450
Manual and semi-automatic large wire wedge bonder. Ideal for laboratory and small or pre-production runs.
Wire Bonder 5432
Manual and semi-automatic wedge bonder in a deep-access fine wire and ribbon bond configuration. Ideal for laboratory and small or pre-production runs.
Wire Bonder 5430
Manual and semi-automatic wedge bonder. Suitable for aluminum and gold wires up to 0.003“. Ideal for laboratory and small or pre-production runs.
Wire Bonder 5410
Manual and semi-automatic gold ball bonder. Ideal for laboratory and small or pre-production runs.
   
   
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