Home l About us l News & Events l Contact

Adding value to Nordic Microelectronics manufacturing industry

Die Bonding
Wire Bonding
Testing & Repair
 Welding
Device Bonding
Wafer
Hybrid
Cleaning
Tools & Materials

CONTACT
MPE Nordic AB
Gränsbovägen 4
SE-152 42 Södertälje
Sweden

Tel +46 (0)8 550 656 59
Fax +46 (0)8 550 156 59
infompenordic.com

SUPPLIERS

F & K Delvotec

GSI Group Inc

DeWeyl Tool

HILPERT

  S.E.T.

SEC

  Norcom
  Tanaka
  Miyachi Unitek
Benchmark Division
  March
  MIDAS
Technology

 

Manual Wire Bonders

Simplicity and flexibility combined in a modern economic package

Motorized movement in z

Touch down sensor

Internal PC

Network capability

Ball-Wedge bond head

Wedge-Wedge bond head

Die Bonder 53XX BDA
Ball + Deep access Wedge bonder. The customer can use it as well as Ballbonder and DA Ribbon bonder, du to the easy change of the bondtools.
Wire Bonder 5330
A manual Wedge-Wedge-Bonder suitable for creating different kinds of loops with the manipulator system.
Minimal operator training makes this table top bonder Ideal for pre-series and small-scale productions.
Wire Bonder 5310
Simplicity and flexibility combined in a modern economic package
The ideal choice for pre-series and small-scale productions.
   
   
MPE Nordic AB © 2005 All rights reserved