The 53XX
family have got an new member and have also been upgraded so the system know
are motrorised in Z and Y.
Motorized movement in z and y
Touch down sensor
Internal PC
Network capability
Ball-Wedge bond head
Wedge-Wedge bond head
Heavy wire bond head
Semiautomated heavy Wire Bonder 5350
A heavey wire bonder 100-500µm wire sutitbel for all
different kinds of application combined a fully programmable, linear Z axis of
60 mm stroke with a motorized Y axis of 4 mm travel. Together they allow the
operator to manually produce loops of any size and shape. The cutting motion
with step-back, cutting and tear-off is done automatically and therefore
perfectly reproducible.
Wire Bonder 53XX BDA Ball + Deep access Wedge bonder. The
customer can use it as well as Ballbonder and DA Ribbon bonder, du to the easy
change of the bondtools.
Wire Bonder 5330
A manual Wedge-Wedge-Bonder suitable for creating different kinds of
loops with the manipulator system.
Minimal operator training makes this table top bonder Ideal for
pre-series and small-scale productions.
Wire Bonder 5310
Simplicity and flexibility combined in a modern economic package
The ideal choice for pre-series and small-scale productions.
mpenordic.com
