F&K Delvotec has
developed the 5th generation of wire bonders that
enables you to use 17 - 600µm wire in the same machine. The
machines are built for high throughput and flexibility their
quality is important.
In
line or stand alone
Different bond heads available
Digital US generator
Front access service
Pat Max pattern recognition system
Quality assurance features
Post Bond Inspection
Wire Bonder 64/66000
The fifth generation Fine and Heavy Wire Bonder
New X/Y table concept
New bond head design
Cognex 8000 Pat Max
Wire Bonder 6600HS
The fastest large wire bonder in the market with the most advanced bond
head in the world, offering bond process control.
Wire Bonder 6400DA
The deep access version of the fine wire wedge bonder for particularly
demanding applications, including ribbon bonding.
Wire Bonder 6400
Our multiple award winning fine wire wedge bonder with unsurpassed
flexibility. Suitable for aluminum and gold wires from 0.0007“ to
0.003“.
Wire Bonder 6210
Pivoting head gold ball bonder for high speed operation in special
applications.
Wire Bonder 6200
Hybrid gold ball bonder with large working area with extreme flexibilty,
featuring auto focus and vertical z-motion, accomodates large height
differences between bond surfaces including. A software flag enables
stud bump bonding instead of wire bonding.
mpenordic.com
