Hot-Bar
technology is used to transfer a defined programmable heating curve into a
dedicated area in order to create a electro-mechanical interconnection between
one or more materials. Depending on material specifications, design of parts
and required functionality of the end product, a specific Hot-Bar process can
be used.
The Hot-Bar process can be divided into 3 functional interconnection methods,
each offering its own specific advantages.
Uniflow 2 is a power supply for pulse-heated selective
soldering, conductive adhesive bonding and thermocompression bonding
•Closed loop temperature and time control
•Displays summary process data
•Real time temperature graph
•Stores 15 heating profiles
•Statistical and graphical data output to PC
•Process alarms and counters.
•Remote programming via PC
Pulsed Heat Thermode Technology for Reflow Soldering and
Heat-Seal Bonding
Miyachi Unitek’s Desktop Series Bonders are standard tabletop Hot-Bar Reflow
Soldering Systems using Pulsed Heat Technology (Uniflow®
power supply), pneumatic bonding heads and Quick
Connect Blocks with Thermo-Plane Thermodes. All modules are mounted on a simple
adjustable frame construction. The Desktop Series includes product handling
features such as left-right and front-rear slides, as well as rotary tables.
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