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For
analog and mixed signal device production, GSI Group WaferTrim™
laser systems are the industry leader in laser trimming of resistors
at the wafer level. Our applications cover power management, data
conversion, sensors, RF, and precision analog devices used in the
rapidly growing mobile communications market.
With active laser trimming, you optimize final device performance
and die yield in real time on the test floor. You eliminate total
dependence on the fab manufacturing processes.
Only through wafer level trimming will you optimize analog circuit
performance, routinely achieving resistor tolerances of less than
0.01%. |
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