Semiconductor Equipment Corporation's wafer/film tape
applicator provides users with the optimal control of temperature
and pressure for achieving uniform bubble-free mounting of
electronic grade processing tape onto wafers and their film frames
for subsequent cutting of wafers into die. The Model 300 is
specifically designed for 300mm wafers.
Semiconductor Equipment Corporation's Model 3100 & 3150 Wafer/Film
Frame Tape Applicators apply tape with optimal control of
temperature and pressure parameters. Uniform, bubble-free mounting
of tape for wafer dicing is the result. State-of-the-art features
make them two of the most advanced systems available. The Model 3100
handles wafers up to 6" in diameter, while the Model 3150 handles
any size wafer up to 8" in diameter. Both models are so versatile,
they can operate with virtually any film frame.
mpenordic.com
Download data sheet for
Model 300