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Wafer Tape Applicators

Model 300 Wafer/Film Frame Tape Applicator

Semiconductor Equipment Corporation's wafer/film tape applicator provides users with the optimal control of temperature and pressure for achieving uniform bubble-free mounting of electronic grade processing tape onto wafers and their film frames for subsequent cutting of wafers into die. The Model 300 is specifically designed for 300mm wafers.

Download data sheet for Model 300

Model 3100 and 3150 Wafer/Film Frame Tape Applicators

Semiconductor Equipment Corporation's Model 3100 & 3150 Wafer/Film Frame Tape Applicators apply tape with optimal control of temperature and pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing is the result. State-of-the-art features make them two of the most advanced systems available. The Model 3100 handles wafers up to 6" in diameter, while the Model 3150 handles any size wafer up to 8" in diameter. Both models are so versatile, they can operate with virtually any film frame.

Download data sheet for Model 3100 and 3150