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Adding value to Nordic Microelectronics manufacturing industry

Die Bonding
Wire Bonding
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Wafer
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CONTACT
MPE Nordic AB
Gränsbovägen 4
SE-152 42 Södertälje
Sweden

Tel +46 (0)8 550 656 59
Fax +46 (0)8 550 156 59
infompenordic.com

SUPPLIERS

F & K Delvotec

GSI Group Inc

DeWeyl Tool

HILPERT

  S.E.T.

SEC

  Norcom
  Tanaka
  Miyachi Unitek
Benchmark Division
  March
  MIDAS
Technology

 

Chip Marking

WaferMark® series laser systems from GSI Group are the recognized industry leaders for wafer marking applications. We have WaferMark solutions for the two most important reasons why you mark wafers and die — traceability and product identification.

GSI Group invented wafer marking processes over 25 years ago and continually innovate solutions for new substrate materials, larger wafer diameters, wafer-level die marking and factory automation

The world’s silicon suppliers, wafer reclaim, and semiconductor manufacturers consistently come to us for unsurpassed mark quality with our hardmark and patented SuperSoftMark® processes

WaferMark® Total Traceability Solutions

WaferMark® CSP200
100 — 200mm Wafer Level Die Marking System

   
   
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