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FOR HIGH RELIABILITY WAFER BONDING
Models 3180 and 3190 are programmable wafer bonders offered by SST
International for high-reliability bonding of silicon, gallium-arsenide and
glass wafers up to 6 inches (150 mm) in diameter.
Both systems provide precise automatic control of heating and cooling at
temperatures up to 500 °C (1000 °C optional). Bellows actuated clamping platens
present uniform mechanical bonding forces up to 750 pounds (5,000 pounds
optional) to the wafer pair. The 3190 also provides anodic (electrostatic)
bonding capabilities with a user-selected high-voltage power supply and chamber
feed-through. Vacuum levels down to 50 millitorr are provided in the 3180 by a
two-stage mechanical pump. Vacuum levels below 1 x 10-6 torr are provided in
the 3190 by a cryogenic vacuum pumping system combined with a dry mechanical
forepump. Digital vacuum level gauging is provided to monitor and control
vacuum levels. Machine control is provided by an embedded control system
operating in a Microsoft Windows® environment. An unlimited number of process
profiles can easily be created and stored in the controller. Run data is
archived for quality control and off-line data analysis. Internet and intranet
network connectivity is available as an option, permitting remote monitoring,
troubleshooting and maintenance capabilities.
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