|
|
|
|
|
Vaccum / Pressure Furnaces
|
|
|
|
|
|
|
|
|
 |
|
|
|
|
|
|
|
|
|
 |
Model 1200 Table top Solder Reflow Station
Ideal for low volume, high reliability hermetic package sealing, eutectic
die attach, process development and university research. |
|
|
 |
Model 3130 Vacuum/Pressure Funaces
The industry standard for flux-free, void-free solder
assembly of hybrids, fiber optic packages, power devices, BGA devices, plus
high temperature glass sealing and brazing processes. |
|
|
|
 |
Model 3140 and 3150 High Vacuum Furnaces
High vacuum thermal processing furnaces used for MEMS package sealing,
getter activation and very high reliability, low moisture hermetic package
sealing. |
|
|
|
 |
Model 5100 Vacuum/Pressure Soldering Furnace
Large format programmable vacuum/pressure soldering
furnace ideally suited for producing high volume microelectronic components
and packages. |
|
|
|
 |
Model PF-2400 High Volume Production Furnace
Designed for high volume, void-free,
vacuum soldering of devices such
as high power rectifiers, large hybrid modules and BGA panels. |
 |
|
|
|
|
|
|