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Adding value to Nordic Microelectronics manufacturing industry

Die Bonding
Wire Bonding
Testing & Repair
 Welding
Device Bonding
Wafer
Hybrid
Cleaning
Tools & Materials

CONTACT
MPE Nordic AB
Gränsbovägen 4
SE-152 42 Södertälje
Sweden

Tel +46 (0)8 550 656 59
Fax +46 (0)8 550 156 59
infompenordic.com

SUPPLIERS

F & K Delvotec

GSI Group Inc

DeWeyl Tool

HILPERT

  S.E.T.

SEC

  Avio
  Norcom
  Tanaka
  Miyachi Unitek
Benchmark Division
  March
  MIDAS
Technology

 

Testing & Repair

Pull/Shear Testing
The automation in the machine makes it possible to do automatic pull/shear testing. The data can be stored in a Database to get the statistics you need.
 

Complete analyzes data

Network compatible

Cost effective machine combines wire bonding & testing

 

     
Wire Pull/Die and Ball Shear Tester 5600
Automatic Pull Tester

Postbond Inspection System
A cost effective way to get 100% inspection of your die and wire bonded parts without adding any floor space or yield lose in your line.

In-line or stand alone testing

Can inspect die placement and scratches on the chip

Can inspect loop height, wire length, tail
length and deformation of wire

Movement in all directions, x, y and z

PBInspect and Zero Defect
Measure parameters such as bond symmetry, bond width, tail length, loop height, loop sway and lift-offs. Reduce the number of reject parts parts and aim for zero defect production using PBInspect
 

HOT Gas Workstation
Rework station for quick removal of chips to minimize thermal shock & physical damage to the board

Vacuum-locked, air-bearing carriage with Xpositioning leadscrew

Quick-change quartz glass nozzles with built-in
thermocouples, available in straight, angled &
shaped styles, orifices .020” - .240”+

Each individual jet can swivel on its mount

Leica stereo zoom, 10X eyepieces, boom mount


Hot Gas Work Station HGRS-V

The HGRS-V reworks today’s highest performance epoxies,
solders and eutectic bonds so safely it’s required in advanced
US military processes. If you can’t remove 80/20-attached die,
are damaging devices with your present rework processes - or
are still tackling stubborn die with 15-minute bakes, hammer,
screwdrivers, and chisels - the HGRS-V IS your answer. Call
us for a detailed review of your application.
 

Inspection

SVS™ series laser systems from GSI Group are the recognized leader in 3-D inspection systems for the board assembly industry. We enable you to achieve high first-pass yield and reduced rework costs with our patented 3-D laser scanning inspection systems.

Industry leading direct laser inspection technology for high accuracy 3-D measurements

Paste height, area, and volume measurements
with Gage R&R <10%

Fully capable of inspecting CSPs, 0201s, or smaller geometries

Inspects panels from 5.1cm x 7.6cm up to 50.8cm x 61.0cm


SVS Ascent, In-Line 100% 3-D Inspection System

A new level of speed, accuracy, and flexibility for 100% in-line inspection in a reliable, affordable package.

Ascent integrates with bar code readers, exports data for SPC, provides easy transport of programs between systems, and produces results that are not impacted by changes in lighting or panel color.
   
   
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