|
|
[2008-09-01]
MPE Nordic has signed another strong supplier MIYACHI
MPE Nordic blir distributör för Miyachis produkter i de
Nordiska länderna Svergie, Finland, Norge och Danmark. Miyachi tillverkar laser
svetsar, resistans svetsar och laser märkare till elektronik industrin.
|
|
|
|
|
|
|
|
|
[2008-02-25]
MPE Nordic has signed another strong supplier S.E.T.
MPE Nordic is proved to announce that we have signed S.E.T. Smart Equipment
Technology as a supplier. S.E.T. is the former Device Bonder Division of SUSS
MicroTec. S.E.T. is a world leading supplier of High Accuracy Device Bonders
and versatile Nano Imprint Lithography solutions.
|
|
|
|
|
|
|
|
|
[2007-08-26]
Upcoming: Productronica show
in Munich 2007-11-13 to 2007-11-16
Meet us at
Productronica in Munich November 2007. Productronica is the only trade fair
that presents the world of electronics in its entirety. Its exhibits range from
development down to services, including manufacturing. Its product-group
categories are organised according to the logical flow of production and to
market requirements. From innovative insertion techniques to the latest solar
modules, a number of new developments - many of them revolutionary - will be on
display at this year’s fair. When it comes to integrating all the links in the
production chain, the world’s fair for this industry is the ideal forum. |
|
|
|
|
|
|
|
|
[2007-03-05]
Meet us at SMT Hybrid Packaging 2007
The spring is here and therefore also the SMT
exhibition in Nürnberg 24-26 April. The SMT exhibition has grown to be one of
the biggest exhibitions for Microelectronics, SMT assembly technologies and
materials. This year most of MPE Nordics suppliers will exhibit and showing
many new developments and machines.
Of course MPE Nordic will be present and would like meet you to discuss your
applications with our suppliers. Please contact us for booking an appointment
or to get tickets to the exhibition. |
|
|
|
|
|
|
|
|
[2007-03-05]
New Bondhead for heavy wire ribbon bonding
F&K Delvotec Bondtechnik has developed a new bondhead
for heavy wire ribbon bonding. The demand of high currents in automotive and
power chip technology has driven the development for heavy wire ribbon bonding.
The machine will be shown at the SMT show in Nürmberg. |
|
|
|
|
|
|
|
|
[2007-03-04]
New paste that prevents purpur pleg
Tanaka Kikinzoku Group has developed a new Lead and cadmium free Au conductor
paste that prevent purpur pleg when using Al wire. The paste has very good
adhesion and works for most applications. As usual Tanaka will gladly modify
the paste to fit your application and needs. |
|
|
|
|
|
|
|
|
[2007-03-04]
F&K Delvotec Bondtechnik has been developed the
PBI inspect further
The PBI can be as a stand alone unit or as an inline
solution. The size of boards the PBI can inspect has been increased from small
and medium size boards in stand alone version to big boards in inline version.
The system will be shown at the SMT show in Nürmberg. |
|
|
|
|
|
|
|
|
[2007-03-04]
New laser inspection system for solder
inspection from GSI Group
GSI Group can proudly announce that their new develop laser inspection system
for solder inspection Ascent will be launched in Europe at the SMT exhibition
in Nürmberg.
The new Ascent system have taken the solder inspection technology one step
further to meet the requirement in speed and accuracy especially when using
small 0201 components. The machine will be shown at the SMT show in Nürmberg. |
|
|
|
|
|
|
|
|
[2007-03-04]
New Patter Recognition System for the Universal
56XX
F&K Delvotec Semicondontor have developed a Patter Recognition System for the
Universal 56XX plat from. The 56XX system is the most flexible system on the
market today. The machine can change heads and can do all bonding techniques
and testing Ball bonding, Wedge bonding, Heavy wire bonding and Pull/Shear
testing. The machine will be shown at the SMT show in Nürmberg. |
|
|
|
|
|
|
|
|
[2007-03-04]
New Lead and cadmium free Pt conductor paste
from very thin layers
Tanaka Kikinzoku Group has developed a new Lead and cadmium free Pt conductor
paste for very thin layers. Because of the ingredients and coverage of the
paste it’s very cost efficient as well. Of course is the As usual Tanaka will
gladly modify the paste to fit your application and needs |
|
|
|
|
|
|
|
|
[2007-02-27]
NEW Service engineer
We are happy to announce that MPE Nordic has hired
Daniel Tyrving as Service Engineer.
He is coming from Micronic Laser Systems AB there he worked as Service Engineer.
Daniel will take care of service of F&K Delvotec manual and automatic Wire
Bonding Systems and Hilpert and Siemens Die Bonding Systems. |
|
|
|
|
|
|
|
|
[2006-09-10]
Elecronix, Gothenbourg 5-7 September 2006
Thank you very much to
all of you that visited us at Electronix in Gothenbourg
5-7 September 2006. Looking forward
to see you again at next show !
 |
|
|
|
|
|
|
|
|
[2006-03-20]
NEW Suppliers
MPE Nordic AB widen it’s
portfolio whit two powerful suppliers in the welding and leak testing area:
Miyachy Unitek Benchmark Division and NorCom Systems, Inc |
|
|
|
|
|
|
|
|
[2006-03-02]
New Bond head for F&K Delvotecs 53XX Series
F&K Delvotec is
proud to inform that we have increased our 53XX series with one additional bond
head, which is a universal head. This bond head is able to do 2 different
bonding methods which are: Ball-bonding from 17,5 µm until 50 µm - exactly what
our 5310 bond head can do - plus also Wedge-Wedge bonding for Deep Access
applications. |
|
|
|
|
|
|
|
|
[2006-01-11]
F&K Delvotec Semiconductor releases a new heavy
wire bond head
To fill the whole spectra of different bonding applications, F&K have now
developeda new bond hand to handle wires from 100-500µm to
their Universal Semi Automatic Wire Bonder 56XX.
The machine can now handle ball bonding, wedge bonding, deep access wedge
bonding, heavy wire bonding, pull testing and shear testing in the same system
by just changing heads.
The operation to change heads takes 1-3 minutes and are very easy.
|
|
|
|
|
|
|
|
|
[2006-01-10]
MPE Sign on another strong supplier, Avio
Avio is one of the world leaders concerning welding equipment and are known for
the quality
and performance. |
|
|
|
|
|
|
|
|
[2006-01-03]
GSI Group has developed a new scanner
To meet higher speed recruitments GSI has developed a new faster 8Mhz scanner
to their
SVS System 8280 and 8380. |
|
|
|
|
|
|
|
|
[2005-12-20]
GSI Lumonics have changed name to GSI Group
To reflect the current structure of the company after acquisitions of other
companies. |
|
|
|
|
|
|
|
|
[2005-09-01]
MPE Nordic sign on another strong
supplier DeWeyl Tool, Inc.
MPE Nordic is pleased to announce that we have signed a distributor
agreement with DeWeyl Tool, Inc. for the Nordic countries Denmark,
Finland, Norway, and Sweden, effective from 1st of September 2005. |
|
|
|
|
|
|
|
|
[2005-11-20]
Thank you very much to
all of you that visited us at Productronica in Munich, Germany. Looking forward
to see you again at next show
|
|
|
|
|
|
|
|
|
[2005-09-28]
Thank you very much to all of you that visited
us at IMAPS Nordic in Tönsberg, Norway.
Looking forward to see you again at next show!
 |
|
|
|
|
|
|
|
[2005-09-01]
MPE Nordic sign on another strong
supplier DeWeyl Tool, Inc.
MPE Nordic is pleased to announce that we have signed a distributor
agreement with DeWeyl Tool, Inc. for the Nordic countries Denmark,
Finland, Norway, and Sweden, effective from 1st of September 2005.
DeWeyl Tool, Inc. manufactures bonding wedges for the
Microelectronics industry. DeWeyl are well known around the world
for high quality and high performing wedges and offer wedges for
both gold and aluminum wires.
Please contact us for more information. |
|
|
|
|
|
[2005-08-31]
F&K Delvotec launch
there new Post Bond Inspection system
The PBI
system makes it possible to get 100% inspected wires and dies with
out adding any floor space or increased production time to your
line. Please contact us for more information. |
|
|
|
|
|
[2005-08-30]
F&K Delvotec
releases two new heads for there new Universal Semiautomatic Wire
Bonder model 56XX.
The Wedge
–Wedge bonding head model number 5630 and Deep Access Wedge-Wedge
Bond head model number 5632. Whit these new heads and the Heavy wire
Wedge-Wedge bond head that’s coming in Q4, 2005 the machine can
handle all kinds of wire bonding plus Pull & Shear testing. The
machine are programmable and can bond in automatic mode after
reading in the reference points. Please contact us for more
information |
|
|
|
|
|
[2005-08-30]
Hilpert
Electronics realeases the 2nd Generation of the Auto/Semi Automated
Die Bonder model 30000.
The new die bonder 30000 series are a multi chip die bonder
developed for small to medium size production volumes and for R&D
work. An extensive offer of accessories/options allows you to
configure your own die bonder according to your exact needs.
Please contact us for more information |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
mpenordic.com
