S.E.T., Smart Equipment
Technology is a world leading supplier of High Accuracy Device Bonders and
versatile Nano Imprint Lithography solutions. S.E.T. is the former Device
Bonder Division of SUSS MicroTec, dedicated to high-end applications for over
30 years and with more than 250 Device Bonders installed worldwide.
S.E.T. Device Bonders offer precise and flexible packaging and assembly
capabilities. They support a wide range of applications: optical packaging
using high speed passive alignment (e.g. laser diodes), FPAs, LCD drivers, MCMs,
and more. For optoelectronics applications, the high accuracy provided by SET
device bonders result in less signal loss and higher product yield at low cost.
Available as an automated system to level, align and bond components
ranging from 0.2 to 100 mm.
For demanding Flip-chip, termosonic or ultrasonic bonding. Can also be used
as a fine placer with very high accuracy.
FC 250
High Accuracy Production Device Bonder with the most
precise chip to wafer
assembly solution. A production system able to level,
align and bond even
the smallest components with ± 1 μm accuracy.
High Force Device Bonder
FC 300
High Accuracy and High Force Device Bonder for wafer diameter up to 300 mm.
The system also features Nanoimprinting capabilities.
High Accuracy Placement & Bonding
Kadett K1
Device Bonder system with a very flexible and open platform for accurate
placement and bonding of various types of Devices on a wide variety of
Substrates. Sub-micron Alignment and Repeatability.
Large Device
Bonding Press
LPD 150 Electrical Press system especially
designed for bonding large light or radiation detectors in sizes ranging
from 50 ~ 150 mm.
High Accuracy
Assembly Cell
TRIAD 05 AP
System ensures the most precise small device bonding and is able to perform
active alignment as well as passive alignment. Post-bonding reaches
accuracy
of ± 0.5 μm.
Nano Imprinting
Stepper
The
Nano Imprinting Stepper is a cutting-edge lithography solution that
combines advantages of E-Beam-Resolution with high throughput and low
cost
of ownership.
The NPS 300 is a very flexible system available as a manually loaded
machine or as a fully automated system. The automated stamp pick up, allows
printing different pattern from different stamps on a wafer within a single
cycle.
NPS 300
Optimized for the production of nanostructures. The system demonstrates
proven cutting-edge technology solutions that meet the economic
requirements
both for R&D and production.
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