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Die bonding is the process of attaching a die down to an
underlying substrate, most commonly a leadframe. The standard component
handling is done starting from Wafer, Gel-Pack or Waffle-Pack.
Hilpert Electronics has a new unique die bonder system constructed especially
for small- to middle-size production volumes and for development. |
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 Manual Die Bonders
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| Automatic/Semi
Automatic Die Bonders |
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