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CONTACT
MPE Nordic AB
Gränsbovägen 4
SE-152 42 Södertälje
Sweden

Tel +46 (0)8 550 656 59
Fax +46 (0)8 550 156 59
infompenordic.com

SUPPLIERS

F & K Delvotec

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GSI Group Inc

DeWeyl Tool

HILPERT

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SEC

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  Tanaka
  Miyachi Unitek
Benchmark Division
  Miyachi
  SST Int.
  March
  MIDAS
Technology

 

Die Bonders

Die bonding is the process of attaching a die down to an underlying substrate, most commonly a leadframe. The standard component handling is done starting from Wafer, Gel-Pack or Waffle-Pack.

Hilpert Electronics has a new unique die bonder system constructed especially for small- to middle-size production volumes and for development.
Manual Die Bonders
 
Automatic/Semi Automatic Die Bonders
 
   
   
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