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Adding value to Nordic Microelectronics manufacturing industry
Die Bonding
Wire Bonding
Testing & Repair
 Welding
Device Bonding
Wafer
Hybrid
Cleaning
Tools & Materials

CONTACT
MPE Nordic AB
Gränsbovägen 4
SE-152 42 Södertälje
Sweden

Tel +46 (0)8 550 656 59
Fax +46 (0)8 550 156 59
 infompenordic.com

SUPPLIERS

F & K Delvotec

GSI Group Inc

DeWeyl Tool

HILPERT

  S.E.T.

SEC

  Norcom
  Tanaka
  Miyachi Unitek
Benchmark Division
  March
  MIDAS
Technology

 

Automatic/Semi Automatic Die Bonders

Hilpert has developed 2nd generation of semiautomatic/automated die bonders. The machines are ideal for small and medium production volumes. The machine is built to customers applications.
Single bond head
Single wafer station
Pick & place plus dispensing & stamping
Chip presentation: wafer, waffle- and gel pack
Flip chip camera
Pattern Recognition System
Automatic/Semi Automatic Die Bonder, Mulit Chip, Multi Placement


Hilpert DB 750 »

The new db750 is a universal die bonder developed especially for small- to middle-size production volumes and for development.

The standard component handling is done starting from Wafer, Gel-Pack or Waffle-Pack. Aside from the automatic assembly and camera pattern
recognition the db750 offers the possibility to manually perform a single assembly operation without the need of complex programming.



 
   
   
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