|
|
|
The manual pick & place stations are very easy to use. Typical
use is for developing and prototyping. |
|
|
 |
Single
bond head |
|
|
Dispensing |
|
|
waffle-
and gel pack |
|
|
Eutectic oven |
|
|
|
|
|
 |
|
|
|
|
 |
T-4909 Manual Diebonder
Manual Die Bonder for pick and
place applications. Integrated dispenser in the bond head, very ergonomic and
easy to use. |
|
|
|
|
|
|
|
 |
T-3002M Manual Diebonder
Manual Die
Bonder with precise alignment and high quality. Can be used for most
applications can pick from wafer, waffle-pack and gel-pack. |
|
|
|
|
|
|
|
|
T-3002 Semi automated Diebonder
Semi
automated Die Bonder motorised Z movement for controlled force. Can be used for
most applications can pick from wafer, waffle-pack and gel-pack. Beam splitter
for Flip-chip applications.
|
|
|
|
|
|
|
|
T-3000-FC3 Semi automated Diebonder
Semi
automated Die Bonder for termo compression and applications that requires
higher forces. Superior ergonomics compared to similar systems |
|
|
|
|
|
|
|
|
|
mpenordic.com
