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Adding value to Nordic Microelectronics manufacturing industry

Die Bonding

Wire Bonding

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Device Bonding

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CONTACT
MPE Nordic AB
Gränsbovägen 4
SE-152 42 Södertälje
Sweden

Tel +46 (0)8 550 656 59
Fax +46 (0)8 550 156 59
infompenordic.com

	SUPPLIERS
		F & K Delvotec
		GSI Group Inc
		DeWeyl Tool
		HILPERT
		S.E.T.
		SEC
		Avio
		Norcom

		Tanaka
		Miyachi Unitek Benchmark Division
		March
		MIDAS Technology

Device Bonders

S.E.T., Smart Equipment Technology is a world leading supplier of High Accuracy Device Bonders and versatile Nano Imprint Lithography solutions. S.E.T. is the former Device Bonder Division of SUSS MicroTec, dedicated to high-end applications for over 30 years and with more than 250 Device Bonders installed worldwide.

S.E.T. Device Bonders offer precise and flexible packaging and assembly capabilities. They support a wide range of applications: optical packaging using high speed passive alignment (e.g. laser diodes), FPAs, LCD drivers, MCMs, and more. For optoelectronics applications, the high accuracy provided by SET device bonders result in less signal loss and higher product yield at low cost.

Automated Device Bonders
	FC 150 Available as an automated system to level, align and bond components ranging from 0.2 to 100 mm. For demanding Flip-chip, termosonic or ultrasonic bonding. Can also be used as a fine placer with very high accuracy.

	FC 250 High Accuracy Production Device Bonder with the most precise chip to wafer assembly solution. A production system able to level, align and bond even the smallest components with ± 1 μm accuracy.

High Force Device Bonder
	FC 300 High Accuracy and High Force Device Bonder for wafer diameter up to 300 mm. The system also features Nanoimprinting capabilities.

High Accuracy Placement & Bonding
	Kadett K1 Device Bonder system with a very flexible and open platform for accurate placement and bonding of various types of Devices on a wide variety of Substrates. Sub-micron Alignment and Repeatability.

Large Device Bonding Press
	LPD 150 Electrical Press system especially designed for bonding large light or radiation detectors in sizes ranging from 50 ~ 150 mm.

High Accuracy Assembly Cell
	TRIAD 05 AP System ensures the most precise small device bonding and is able to perform active alignment as well as passive alignment. Post-bonding reaches accuracy of ± 0.5 μm.

Nano Imprinting Stepper
	The Nano Imprinting Stepper is a cutting-edge lithography solution that combines advantages of E-Beam-Resolution with high throughput and low cost of ownership. The NPS 300 is a very flexible system available as a manually loaded machine or as a fully automated system. The automated stamp pick up, allows printing different pattern from different stamps on a wafer within a single cycle. NPS 300 Optimized for the production of nanostructures. The system demonstrates proven cutting-edge technology solutions that meet the economic requirements both for R&D and production.